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What Is Integrated Circuit Abbreviations?-Electronic Component Guide

What Is Integrated Circuit Abbreviations?-Electronic Component Guide

November 24 , 2023 0

What Is Integrated Circuit Abbreviations?

Integrated Circuit Abbreviations.An integrated circuit (also known as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip.

What Is Integrated Circuit?

An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors and inductors required in a circuit and wiring are interconnected together, made on a small or several small pieces of semiconductor chips or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit functions; All components have been structurally formed as a whole, making electronic components a big step forward in terms of miniaturization, low power consumption, intelligence and high reliability. It is represented in the circuit by the letter "IC".

The integrated circuit was invented by Jack Kilby (Ge based integrated circuit) and Robert Noyth (Si based integrated circuit). The majority of applications in today's semiconductor industry are silicon-based integrated circuits.

Integrated circuit is a new type of semiconductor device developed in the late 1950s and 1960s. It is through oxidation, lithography, diffusion, epitaxy, aluminum and other semiconductor manufacturing processes, the semiconductor, resistance, capacitance and other components required to form a circuit with a certain function and the connection wires between them are all integrated on a small piece of silicon, and then welded and packaged in a tube shell of the electronic device. The package shell has various forms such as round shell type, flat type or double in-line type.

Integrated circuit technology includes chip manufacturing technology and design technology, which is mainly reflected in the ability of processing equipment, processing technology, packaging and testing, mass production and design innovation.

Manufacture OF Integrated Circuits

The general process of lithography is that a wafer (usually 300mm in diameter) is coated with a layer of photoresist, and then light is irradiated to the wafer through a maskorreticle that has been engraved with a circuit pattern, and the photoresist part of the wafer is sensitive (to the part that should be patterned). Then do the subsequent dissolve photoresist, etching wafer and other processing. Then apply a layer of photoresist and repeat the above steps dozens of times to achieve the required requirements.

See the diagram below for a simplified structure. Mask and wafer version respectively installed on a moving platform (reticlestageandwaferstage). During lithography, the two move to the specified position and the light source is turned on. After the light passes through the mask plate, it passes through the lens, which is able to shrink the circuit pattern to a quarter of its original size, and then projected onto the wafer, making the photoresist partially sensitive.

There are many Dies on a wafer, and each die is engraved with the same circuit pattern, that is, a wafer can produce many chips. The typical size of a die is 26 x 32mm.
There are two main types of lithography machines, one is called stepper, that is, after the mask plate and a die on the wafer are in place, the light source opens and closes to complete a lithography, and then the wafer movement makes the next die in place for another lithography, and so on.
The other type of lithography machine is called scanner, that is, the light is limited to a slit area, lithography, the mask and the wafer move at the same time, so that the light is scanned across a die area, so that the circuit pattern is engraved on the wafer (see figure (b)).
The advantage of the scanner over the stepper is that it can provide a larger die size. The reason for this is that for a fixed size circular lens, such as a 32mm diameter circle (refers to the size of the projected area), the area of light that is allowed to pass through is limited.
If stepper's step-and-expose method is used for lithography, the region of a die must be able to be contained in a circle with a diameter of 32mm, so the size of the largest die that can be obtained is 22×22mm. If the scanner's step-and-scan method is used, the rectangular area provided by the lens can be up to 26mm (26×8mm) or longer. Set the optical slit to this size and use the scanning method to obtain an area of 26×Lmm (L is the scanning length). The regional views are shown in Figure (a) below. The fact that the same lens can achieve a larger area under the stepper is that when you need to produce larger chips, replacing a larger lens is expensive.

Diagram of the Scanner's step-and-scan process

In order to make each layer of circuits do not interfere with each other, it is necessary to carry out precise motion control on the upper and lower platforms. When scanning, the upper and lower platforms should be in uniform motion stage. Currently, the smallest stacking error is less than 2nm (within a single machine) or 3nm (between different machines).
The wavelengths of light sources are typically 365, 248, 193, 157 or even 13.5nm (EUV, ExtremeUltraviolet). Because the lithography process is limited by diffraction, the smaller the wavelength of the light source, the smaller the chip size that can be made.
Adding a liquid (such as water) with a refractive index greater than 1 between the lens and the wafer reduces the wavelength of light, thereby improving NA (numerical aperture) and resolution. This lithography machine is called immersion lithography machine.

The Relationship Between Semiconductors, Chips, And Integrated Circuits

What's The Difference Between A Chip And An Integrated Circuit?

The emphasis to express is different.

Chip is chip, generally refers to you can see with the naked eye is covered with a lot of small feet or feet can not see, but is very obvious square that piece of things. However, the chip also includes a variety of chips, such as baseband, voltage conversion, and so on.

The processor emphasizes the function more, which refers to the unit that performs processing, which can be said to be MCU, CPU, etc.

The integrated circuit range is much wider, the integration of some resistance capacitor diodes is an integrated circuit, may be an analog signal conversion chip, may also be a logic control chip, but in general, the concept is more biased to the bottom things.

Integrated circuit refers to the active devices and passive components of the circuit and their interconnections are made together on a semiconductor substrate or an insulating substrate to form a structurally closely related and internally related electronic circuit. It can be divided into three main branches: semiconductor integrated circuit, membrane integrated circuit and hybrid integrated circuit.

chip (chip) is the general name of semiconductor component products, is the carrier of integrated circuit (IC, integrated circuit), which is divided by wafer.

What Is The Relationship And Difference Between Semiconductor Integrated Circuits And Semiconductor Chips?

Chip is a short for integrated circuit, in fact, the real meaning of the word chip refers to the integrated circuit package inside a little bit of a large semiconductor chip, that is, the core. Strictly speaking, chips and integrated circuits are not interchangeable. Integrated circuits are manufactured by semiconductor technology, thin film technology and thick film technology, and those that miniaturize circuits with certain functions can be called integrated circuits in a certain packaged circuit form. A semiconductor is a substance that is between a good conductor and a bad conductor (or insulator).