Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics

  1. Home
  2. Products
  3. Integrated Circuits (ICs)
  4. Embedded
  5. System On Chip (SoC)
  6. XCZU17EG-3FFVD1760E
XCZU17EG-3FFVD1760E
XCZU17EG-3FFVD1760E
Favorite Products
Share:  

XCZU17EG-3FFVD1760E

XCZU17EG-3FFVD1760E
Xilinx AMD
IC SOC CORTEX-A53 1760FCBGA
System On Chip (SoC)
Available
RoHS Compliant
Datasheet
Available In Stock
Please send RFQ, we will respond immediately
Just Fill in the content with an*
Contact Information
(You can also Log In and fill in automatically)
*
*
*
*
*
Product Attributes
Type PARAMETERS
Architecture
MCU, FPGA
Peripherals
DMA, WDT
Series
Zynq® UltraScale+™ MPSoC EG
Package
Tray
RAM Size
256KB
Supplier Device Package
1760-FCBGA (42.5x42.5)
Flash Size
-
Base Product Number
XCZU17
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Package / Case
1760-BBGA, FCBGA
Number of I/O
308
Mfr
AMD Xilinx
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
600MHz, 667MHz, 1.5GHz
Product Status
Active
Primary Attributes
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature
0°C ~ 100°C (TJ)
TOP
RFQ List ( 0 items)