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Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics

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DRA829VMTGBALFQ1
DRA829VMTGBALFQ1
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DRA829VMTGBALFQ1

DRA829VMTGBALFQ1
Texas Instruments/TI
PROTOTYPE
System On Chip (SoC)
Available
RoHS Compliant
Available In Stock
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Product Attributes
Type PARAMETERS
Series
-
Architecture
DSP, MCU, MPU
Speed
2GHz, 1GHz, 1.35GHz, 1GHz
Supplier Device Package
827-FCBGA (24x24)
Peripherals
DMA, PWM, WDT
Primary Attributes
-
Mfr
Texas Instruments
Product Status
Active
Flash Size
-
RAM Size
1.5MB
Package
Bulk
Connectivity
I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Operating Temperature
-40°C ~ 125°C (TJ)
Package / Case
827-BFBGA, FCBGA
Number of I/O
226
Core Processor
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
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Joinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031
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