Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics

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XCVM1302-2MLIVSVD1760
XCVM1302-2MLIVSVD1760
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XCVM1302-2MLIVSVD1760

XCVM1302-2MLIVSVD1760
Xilinx/AMD
IC VERSALPRIME ACAP FPGA 1760BGA
System On Chip (SoC)
Available
RoHS Compliant
Datasheet
Available In Stock
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Product Attributes
Type PARAMETERS
Speed
600MHz, 1.4GHz
Number of I/O
402
Flash Size
-
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Architecture
MPU, FPGA
Supplier Device Package
1760-FCBGA (40x40)
Mfr
AMD
Package
Tray
Product Status
Active
Peripherals
DDR, DMA, PCIe
Primary Attributes
Versal™ Prime FPGA, 70k Logic Cells
Series
Versal™ Prime
Package / Case
1760-BFBGA, FCBGA
RAM Size
-
Operating Temperature
-40°C ~ 100°C (TJ)
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