Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK Limited518031About Join WinJoinwin Electronics HK Limited FLAT/RM 29, 22/F, YAN’S TOWER, 25-27 WONG CHUK HANG ROAD,ABERDEEN HONGKONG Shenzhen ZhongYiYingTong Technology Limited Room 1610, Block A, Overseas Decorative Building, Zhenhua Road,Huaqiang North Street, Shenzhen, 518031Join-Win will be your one-stop purchasing assistant. Join together, achieve win-win!Joinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics HK LimitedJoinwin Electronics

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XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I
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XCZU15EG-2FFVB1156I

XCZU15EG-2FFVB1156I
Xilinx/AMD
IC SOC CORTEX-A53 1156FCBGA
System On Chip (SoC)
Available
RoHS Compliant
Datasheet
Available In Stock
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Product Attributes
Type PARAMETERS
Supplier Device Package
1156-FCBGA (35x35)
Package
Tray
Speed
533MHz, 600MHz, 1.3GHz
Base Product Number
XCZU15
Number of I/O
328
RAM Size
256KB
Product Status
Active
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Mfr
AMD
Series
Zynq® UltraScale+™ MPSoC EG
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
1156-BBGA, FCBGA
Architecture
MCU, FPGA
Flash Size
-
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
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